So, whatever I use as thermal paste in the new build, I don't plan to reseat it like ever. I currently use x5680 Xeon that I seated with some no name thermal paste 6 years ago and the temps have been perfectly constant (prime95 88 C) 4,4Ghz. DeepCool AK500 Check Price 4 Noctua NH-U14S Check Price 5 Zalman CNPS 10X Performa Blackout Check Price (Image credit: Tom's Hardware) of 2: Best Air CPU Coolers : Best Air CPU. So, yes, in principle the greater thermal conductivity of a liquid metal might be helpful in some designs. But will there be some longterm complications / deterioration for using conductonaut liquid metal instead of some "more traditional" thermal paste? The only remaining question is about the longevity of the cooling solution where I use liquid metal between the cpu and cooler (I know how to apply it, so I am not worried about that being somehow difficult). The cooler is noctua D15 chromax, which is nickel plated copper. However, the thermal paste is Thermal Grizzly Conductonaut, which is liquid metal. The most recommended liquid metal TIM is Thermal Grizzly Conductonaut.I have all components, save processor (gonna get 5900x), for my upcoming build. Due to thermal cycling, a process known as “pump-out” will expel pTIM from between the Die and the heat sink surface (IHS or cooler), whereas liquid metal is very resistant to pump-out.Īlthough Intel's pTIM is formulated to resist pump-out, it still degrades over time, losing its thermal bond with the Die. Paste (pTIM) will fail in a relatively brief period of time. Whether you delid and use direct Die or remount the IHS, delidding requires that you use only liquid metal TIM. However, since the thermal difference between direct Die and remounting the IHS is only ~3☌, there's little to be gained compared to ~20☌ by just replacing Intel's paste. Thermal-hydraulic analysis for fuel elements with liquid-metal cooling Full Record Related Research Abstract From 4th international seminar on heat and mass transfer in liquid metals Trojir, Yugoslavia (). To properly implement direct Die cooling, it is instead highly recommended that you order a compatible socket 1151 Delid Die Guard that compensates for these mechanical differences, and to ensure that you don't crack the Die. Solving these mechanical challenges requires that you implement a "creative" home-made solution. Further, the absence of the CPU retention bracket and the IHS alters the design dimensions for the cooler fastening hardware, which in turn alters the contact pressure. Liquid metal cooled fast reactors, LMFR, use a coolant on the primary side that is metal base, the most common designs being sodium cooled or lead-bismuth cooled. Moreover, the Die can be cracked by impatiently mounting the cooler, when special care and attention is not given to very gradually and evenly tightening the fasteners in an "X" pattern. Also, when the substrate flexes it can crack the Die. This forces the socket pins to deflect, which causes a loss of contact with the substrate pads that in turn creates connectivity failures such as PCH, RAM and PCIE slots. When I upgraded to Threadripper I thought what the hell and ordered der8auers delid and some Thermal Grizzly conductonaut. I had tried several thermal pastes and none were lowering the temp. Since the substrate is supported by the socket perimeter, when weight and pressure from the cooler is applied to the Die (especially a large heavy air cooler), without an IHS to support the mechanical load, the substrate will significantly flex in the area around the Die. ago I had a particularly bad 4790k that would run around 46-48c idle even watercooled. Previous Generations of Intel processors used a more rigid substrate that is 1.1mm thick, while 6th through 8th Generation is only 0.8mm thick, which means it's relatively fragile. However, there are other factors involved when considering direct Die cooling. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant. Intel's internal pTIM (paste Thermal Interface Material) imposes the greatest loss of thermal efficiency, whereas the IHS accounts for only a few degrees. Although some heat dissipates to the substrate, socket and motherboard, most heat dissipates to the cooler through several thermal gradients Cores > Die > internal TIM (Thermal Interface Material either solder or paste) > IHS > external TIM (paste) > cooler.ĭirect Die cooling removes two of these gradients. Free Shipping ONOFF In Stock ONOFF On Sale ONOFF Department Any Category Fans & PC Cooling Thermal Compound / Grease Manufacturer ARCTIC COOLING Hetai Tech Corn Electronics EKUPUZ Thermal Grizzly Vetroo ALIEN TECHNOLOGY Gigbird Nab Cooling Amify Coollaboratory sakose THE ORDINARY Alphacool Bluesolids.
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